solder reflow soldering
英 [ˈsəʊldə(r) ˈriːfləʊ ˈsəʊldəɪŋ]
美 [ˈsɑːdər ˈriːfloʊ ˈsɑːdərɪŋ]
回流锡焊
双语例句
- HOT BARThe hot wire is widely used in welding, solder reflow soldering.
广泛应用于线材的热压焊、焊锡焊接的回流焊，IC贴片。 - Automatic Management System of Solder Joint Reliability in Reflow Soldering
再流焊焊点可靠性自动管理系统 - Tombstone phenomenon results from unbalance of solder surface tension on two pads of component soldering terminal during reflow soldering.
竖碑现象是元件两端焊盘上的焊膏在回流熔化时对元件两个焊接端的表面张力不平衡所致。 - Interfacial reactions between Sn-Cu solder alloy and Cu/ Ni coatings during reflow soldering
SnCu钎料镀层与Cu/Ni镀层钎焊接头的界面反应 - Attention questions and measures during BGA assembly were analyzed to increase BGA assembly quality by BGA package, PCB design, solder paste print, place BGA, and reflow soldering process.
从BGA的封装形式、PCB的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了BGA组装过程中应注意的问题及其预防措施。 - Some influencing factors of application of lead-free soldering technology are investigated, such as choice of lead-free solder and components, application design of PCB, improvement of reflow soldering temperature curve, reflow soldering by nitrogen protection, optimization of technology.
对无铅焊接技术应用中的无铅焊料选择、元器件选定、印制电路板（PCB）应用设计、再流焊温度曲线改善、氮气保护再流焊、工艺控制与优化等进行了具体分析和研究。 - Then it expatiated how to use DFM principle to enhance the design quality, control the quality of solder paste strictly and set the temperature curve of reflow soldering reasonably.
详细阐述了采用DFM原则提高设计质量、严格控制印膏质量和合理设置再流焊接温度曲线3个方面的试验过程。 - Effect of Cooling Rate on Quality of Solder Joints in Lead-Free Reflow Soldering
无铅回流焊冷却速率对焊点质量的影响实施倒装芯片的组装 - Conventional wave soldering exist leak welding, solder joint icicles, PCB deformation, etc. Reflow soldering temperature is too high, and both of them have a high cost.
传统的波峰焊存在漏焊、焊点拉尖、PCB变形等问题，回流焊存在温度过高，且两者成本都很高。